CVE-2015-9218

MEDIUM

Qualcomm Snapdragon Mobile and Wear Firmware - Denial of Service via HEVC Clip Processing

Title source: llm
STIX 2.1

Description

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, when processing bad HEVC clips, the DPB fills, and with no error handling for DPB being full, a hang occurs.

References (2)

Core 2
Core References
Vendor Advisory x_refsource_confirm
https://source.android.com/security/bulletin/2018-04-01
Third Party Advisory, VDB Entry vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/103671

Scores

CVSS v3 5.5
EPSS 0.0005
EPSS Percentile 14.4%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:N/A:H

Details

CWE
CWE-388
Status published
Products (24)
qualcomm/msm8909w_firmware
qualcomm/sd_205_firmware
qualcomm/sd_210_firmware
qualcomm/sd_212_firmware
qualcomm/sd_400_firmware
qualcomm/sd_410_firmware
qualcomm/sd_412_firmware
qualcomm/sd_425_firmware
qualcomm/sd_427_firmware
qualcomm/sd_430_firmware
... and 14 more
Published Apr 18, 2018
Tracked Since Feb 18, 2026