CVE-2016-2063
HIGHLinux Kernel 3.0-3.19.8 - Stack-Based Buffer Overflow in MSM Thermal Driver via Debugfs Interface
Title source: llmDescription
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
References (3)
Core 3
Core References
Third Party Advisory, VDB Entry vdb-entry
x_refsource_bid
http://www.securityfocus.com/bid/92381
Mailing List, Patch, Third Party Advisory x_refsource_confirm
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
Broken Link x_refsource_confirm
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063
Scores
CVSS v3
7.8
EPSS
0.0046
EPSS Percentile
36.7%
Attack Vector
LOCAL
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Details
CWE
CWE-119
Status
published
Products (1)
linux/linux_kernel
3.0 - 3.19.8
Published
Aug 07, 2016
Tracked Since
Feb 18, 2026