CVE-2017-18157

HIGH

Qualcomm Multiple Chipsets Firmware - Use-After-Free in Thermal Engine

Title source: llm

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

References (1)

Core 1

Core References

Vendor Advisory x_refsource_confirm

https://www.qualcomm.com/company/product-security/bulletins

Scores

CVSS v3 7.8

EPSS 0.0009

EPSS Percentile 25.3%

Attack Vector LOCAL

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE

CWE-416

Status published

Products (21)

qualcomm/mdm9206_firmware

qualcomm/mdm9607_firmware

qualcomm/mdm9650_firmware

qualcomm/msm8909w_firmware

qualcomm/msm8996au_firmware

qualcomm/sd_205_firmware

qualcomm/sd_210_firmware

qualcomm/sd_212_firmware

qualcomm/sd_415_firmware

qualcomm/sd_425_firmware

... and 11 more

Published May 06, 2019

Tracked Since Feb 18, 2026