CVE-2017-18295

HIGH

Qualcomm Multiple Chipsets Firmware - Buffer Overflow in DSP Service Module

Title source: llm

Description

Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20.

References (3)

Core 3

Core References

Vendor Advisory x_refsource_confirm

https://www.qualcomm.com/company/product-security/bulletins

Third Party Advisory, VDB Entry vdb-entry x_refsource_sectrack

http://www.securitytracker.com/id/1041432

Third Party Advisory x_refsource_confirm

https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components

Scores

CVSS v3 7.8

EPSS 0.0005

EPSS Percentile 14.7%

Attack Vector LOCAL

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE

CWE-119

Status published

Products (19)

qualcomm/mdm9206_firmware

qualcomm/mdm9607_firmware

qualcomm/mdm9650_firmware

qualcomm/msm8909w_firmware

qualcomm/msm8996au_firmware

qualcomm/sd_205_firmware

qualcomm/sd_210_firmware

qualcomm/sd_212_firmware

qualcomm/sd_415_firmware

qualcomm/sd_450_firmware

... and 9 more

Published Oct 23, 2018

Tracked Since Feb 18, 2026