CVE-2017-18323

MEDIUM

Qualcomm Snapdragon Firmware - Cryptographic Key Material Leak via TDSCDMA RRC Debug Messages

Title source: llm
STIX 2.1

Description

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

References (2)

Core 2
Core References
Third Party Advisory, VDB Entry vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/106128

Scores

CVSS v3 5.5
EPSS 0.0005
EPSS Percentile 16.1%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N

Details

CWE
CWE-320
Status published
Products (35)
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9615_firmware
qualcomm/mdm9635m_firmware
qualcomm/mdm9640_firmware
qualcomm/mdm9645_firmware
qualcomm/mdm9650_firmware
qualcomm/mdm9655_firmware
qualcomm/msm8909w_firmware
qualcomm/msm8996au_firmware
... and 25 more
Published Jan 03, 2019
Tracked Since Feb 18, 2026