CVE-2017-18324

MEDIUM

Qualcomm Snapdragon Mobile and Wear Firmware - Cryptographic Key Material Exposure via GERAN Debug Messages

Title source: llm
STIX 2.1

Description

Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016.

References (2)

Core 2
Core References
Third Party Advisory, VDB Entry vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/106128

Scores

CVSS v3 5.5
EPSS 0.0005
EPSS Percentile 16.1%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N

Details

CWE
CWE-200
Status published
Products (32)
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9615_firmware
qualcomm/mdm9625_firmware
qualcomm/mdm9635m_firmware
qualcomm/mdm9645_firmware
qualcomm/mdm9650_firmware
qualcomm/mdm9655_firmware
qualcomm/msm8909w_firmware
qualcomm/sd_205_firmware
... and 22 more
Published Jan 03, 2019
Tracked Since Feb 18, 2026