CVE-2017-18330

HIGH

Qualcomm Snapdragon Firmware - Buffer Overflow in AES-CCM and AES-GCM via Initialization Vector

Title source: llm

Description

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.

References (2)

Core 2

Core References

Vendor Advisory x_refsource_confirm

https://www.qualcomm.com/company/product-security/bulletins

Third Party Advisory, VDB Entry vdb-entry x_refsource_bid

http://www.securityfocus.com/bid/106128

Scores

CVSS v3 7.8

EPSS 0.0002

EPSS Percentile 6.8%

Attack Vector LOCAL

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

Status published

Products (39)

qualcomm/ipq8074_firmware

qualcomm/mdm9206_firmware

qualcomm/mdm9607_firmware

qualcomm/mdm9635m_firmware

qualcomm/mdm9640_firmware

qualcomm/mdm9650_firmware

qualcomm/mdm9655_firmware

qualcomm/msm8909w_firmware

qualcomm/msm8996au_firmware

qualcomm/sd_205_firmware

... and 29 more

Published Jan 03, 2019

Tracked Since Feb 18, 2026