CVE-2018-11264

HIGH

Qualcomm Mdm9206 Firmware - Memory Corruption

Title source: rule
STIX 2.1

Description

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

References (2)

Core 2
Core References
Third Party Advisory, VDB Entry vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/105838

Scores

CVSS v3 7.8
EPSS 0.0004
EPSS Percentile 12.3%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-119
Status published
Products (19)
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9650_firmware
qualcomm/msm8996au_firmware
qualcomm/sd_205_firmware
qualcomm/sd_210_firmware
qualcomm/sd_212_firmware
qualcomm/sd_410_firmware
qualcomm/sd_412_firmware
qualcomm/sd_425_firmware
... and 9 more
Published Nov 28, 2018
Tracked Since Feb 18, 2026