CVE-2018-11267

HIGH

Qualcomm Snapdragon Firmware - Memory Corruption via Malformed XML in Firehose

Title source: llm
STIX 2.1

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.

References (2)

Core 2
Core References
Third Party Advisory, VDB Entry vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/106128

Scores

CVSS v3 7.8
EPSS 0.0004
EPSS Percentile 11.5%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-129
Status published
Products (39)
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9615_firmware
qualcomm/mdm9640_firmware
qualcomm/mdm9650_firmware
qualcomm/mdm9655_firmware
qualcomm/msm8996au_firmware
qualcomm/sd205_firmware
qualcomm/sd210_firmware
qualcomm/sd212_firmware
... and 29 more
Published Sep 20, 2018
Tracked Since Feb 18, 2026