CVE-2018-11847

HIGH

Snapdragon Auto- Snapdragon Compute - Memory Corruption

Title source: llm
STIX 2.1

Description

Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016

References (2)

Core 2
Core References
Third Party Advisory vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/106475

Scores

CVSS v3 7.8
EPSS 0.0003
EPSS Percentile 10.0%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-20
Status published
Products (33)
qualcomm/ipq8074_firmware
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9650_firmware
qualcomm/mdm9655_firmware
qualcomm/msm8909w_firmware
qualcomm/msm8996au_firmware
qualcomm/qca8081_firmware
qualcomm/sd_205_firmware
qualcomm/sd_210_firmware
... and 23 more
Published Feb 11, 2019
Tracked Since Feb 18, 2026