CVE-2018-11976

MEDIUM

Qualcomm Snapdragon - Info Disclosure

Title source: llm
STIX 2.1

Description

ECDSA signature code leaks private keys from secure world to non-secure world in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

References (1)

Core 1
Core References

Scores

CVSS v3 5.5
EPSS 0.0004
EPSS Percentile 13.9%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N

Details

CWE
CWE-200
Status published
Products (46)
qualcomm/ipq8074_firmware
qualcomm/mdm9150_firmware
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9650_firmware
qualcomm/mdm9655_firmware
qualcomm/msm8909w_firmware
qualcomm/msm8996au_firmware
qualcomm/qca8081_firmware
qualcomm/qcs605_firmware
... and 36 more
Published May 24, 2019
Tracked Since Feb 18, 2026