CVE-2018-11982

HIGH

Snapdragon - Memory Corruption

Title source: llm

Description

In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.

References (1)

[Third Party Advisory] https://www.qualcomm.com/company/product-security/bulletins

Scores

CVSS v3 8.8

EPSS 0.0008

EPSS Percentile 23.7%

Attack Vector ADJACENT_NETWORK

CVSS:3.0/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Classification

CWE

CWE-415

Status published

Affected Products (28)

qualcomm/mdm9206_firmware

qualcomm/mdm9607_firmware

qualcomm/mdm9635m_firmware

qualcomm/mdm9640_firmware

qualcomm/mdm9645_firmware

qualcomm/mdm9655_firmware

qualcomm/msm8909w_firmware

qualcomm/msm8996au_firmware

qualcomm/sd210_firmware

qualcomm/sd212_firmware

qualcomm/sd205_firmware

qualcomm/sd410_firmware

qualcomm/sd412_firmware

qualcomm/sd425_firmware

qualcomm/sd427_firmware

... and 13 more

Timeline

Published Sep 20, 2018

Tracked Since Feb 18, 2026