CVE-2018-13888

HIGH

Qualcomm MDM9206 and related firmware - Memory Corruption in RIL Daemon

Title source: llm
STIX 2.1

Description

There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.

References (2)

Core 2
Core References
Third Party Advisory vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/106475

Scores

CVSS v3 7.8
EPSS 0.0004
EPSS Percentile 11.8%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-119
Status published
Products (32)
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9635m_firmware
qualcomm/mdm9650_firmware
qualcomm/msm8909w_firmware
qualcomm/sd_205_firmware
qualcomm/sd_210_firmware
qualcomm/sd_212_firmware
qualcomm/sd_425_firmware
qualcomm/sd_427_firmware
... and 22 more
Published Feb 11, 2019
Tracked Since Feb 18, 2026