CVE-2018-5867

HIGH

Qualcomm Multiple Chipsets - Buffer Overflow in WideVine

Title source: llm
STIX 2.1

Description

Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130

References (2)

Core 2
Core References
Third Party Advisory, VDB Entry vdb-entry x_refsource_bid
http://www.securityfocus.com/bid/106128

Scores

CVSS v3 7.8
EPSS 0.0004
EPSS Percentile 12.3%
Attack Vector LOCAL
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-119
Status published
Products (38)
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9635m_firmware
qualcomm/mdm9650_firmware
qualcomm/mdm9655_firmware
qualcomm/msm8996au_firmware
qualcomm/sd_205_firmware
qualcomm/sd_210_firmware
qualcomm/sd_212_firmware
qualcomm/sd_410_firmware
... and 28 more
Published Jan 18, 2019
Tracked Since Feb 18, 2026