Description
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
References (2)
Core 2
Core References
Broken Link x_refsource_confirm
https://www.qualcomm.com/company/product-security/bulletins/july-2020-bulletin
Patch, Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/july-2020-security-bulletin
Scores
CVSS v3
7.8
EPSS
0.0004
EPSS Percentile
13.6%
Attack Vector
LOCAL
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Details
CWE
CWE-416
Status
published
Products (31)
qualcomm/apq8009_firmware
qualcomm/apq8053_firmware
qualcomm/apq8096au_firmware
qualcomm/apq8098_firmware
qualcomm/mdm9206_firmware
qualcomm/mdm9207c_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9640_firmware
qualcomm/mdm9650_firmware
qualcomm/msm8905_firmware
... and 21 more
Published
Jul 30, 2020
Tracked Since
Feb 18, 2026