CVE-2019-14093

HIGH

Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, ...

Title source: llm
STIX 2.1

Description

Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20

References (2)

Core 2

Scores

CVSS v3 7.8
EPSS 0.0004
EPSS Percentile 13.2%
Attack Vector LOCAL
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-129
Status published
Products (31)
qualcomm/apq8009_firmware
qualcomm/apq8017_firmware
qualcomm/apq8053_firmware
qualcomm/apq8096au_firmware
qualcomm/apq8098_firmware
qualcomm/mdm9206_firmware
qualcomm/mdm9207c_firmware
qualcomm/mdm9607_firmware
qualcomm/mdm9650_firmware
qualcomm/msm8909w_firmware
... and 21 more
Published Jul 30, 2020
Tracked Since Feb 18, 2026