CVE-2019-19196

MEDIUM

Telink Semiconductor BLE SDK < November 2019 - Buffer Overflow

Title source: llm
STIX 2.1

Description

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

References (2)

Core 2
Core References
Vendor Advisory x_refsource_misc
http://www.telink-semi.com/ble
Exploit, Third Party Advisory x_refsource_misc
https://asset-group.github.io/disclosures/sweyntooth/

Scores

CVSS v3 6.5
EPSS 0.0012
EPSS Percentile 30.2%
Attack Vector ADJACENT_NETWORK
CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H

Details

CWE
CWE-120
Status published
Products (5)
telink-semi/tlsr8232_ble_sdk < 1.3.0
telink-semi/tlsr8251_ble_sdk < 3.4.0
telink-semi/tlsr8253_ble_sdk < 3.4.0
telink-semi/tlsr8258_ble_sdk < 3.4.0
telink-semi/tlsr8269_ble_sdk < 3.3
Published Feb 12, 2020
Tracked Since Feb 18, 2026