CVE-2019-2288

HIGH

Out of bound write in TZ - Memory Corruption

Title source: llm
STIX 2.1

Description

Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130

References (1)

Core 1

Scores

CVSS v3 7.8
EPSS 0.0009
EPSS Percentile 26.0%
Attack Vector LOCAL
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

CWE
CWE-120
Status published
Products (40)
qualcomm/apq8009_firmware
qualcomm/apq8017_firmware
qualcomm/apq8053_firmware
qualcomm/apq8096_firmware
qualcomm/apq8096au_firmware
qualcomm/apq8098_firmware
qualcomm/ipq8074_firmware
qualcomm/mdm9150_firmware
qualcomm/mdm9206_firmware
qualcomm/mdm9607_firmware
... and 30 more
Published Dec 12, 2019
Tracked Since Feb 18, 2026