CVE-2022-25698

HIGH

Qualcomm Snapdragon Mobile and Wearables Firmware - Memory Corruption via SPI Bus Address Configuration

Title source: llm

Description

Memory corruption in SPI buses due to improper input validation while reading address configuration from spi buses in Snapdragon Mobile, Snapdragon Wearables

References (1)

Core 1

Core References

Vendor Advisory

https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin

Scores

CVSS v3 8.4

EPSS 0.0005

EPSS Percentile 15.5%

Attack Vector LOCAL

CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

CISA SSVC

Vulnrichment

Exploitation none

Automatable no

Technical Impact total

Details

CWE

CWE-787

Status published

Products (16)

qualcomm/sd429_firmware

qualcomm/sd_8_gen1_5g_firmware

qualcomm/sda429w_firmware

qualcomm/sdm429w_firmware

qualcomm/wcd9380_firmware

qualcomm/wcn3610_firmware

qualcomm/wcn3620_firmware

qualcomm/wcn3660b_firmware

qualcomm/wcn3680b_firmware

qualcomm/wcn3980_firmware

... and 6 more

Published Dec 13, 2022

Tracked Since Feb 18, 2026