CVE-2024-23360

HIGH

Qualcomm FastConnect and Snapdragon Firmware - Memory Corruption via LPAC Client Creation

Title source: llm
STIX 2.1

Description

Memory corruption while creating a LPAC client as LPAC engine was allowed to access GPU registers.

Scores

CVSS v3 8.4
EPSS 0.0009
EPSS Percentile 26.0%
Attack Vector LOCAL
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

CISA SSVC

Vulnrichment
Exploitation none
Automatable no
Technical Impact total

Details

CWE
CWE-284
Status published
Products (13)
qualcomm/fastconnect_6700_firmware
qualcomm/fastconnect_6900_firmware
qualcomm/fastconnect_7800_firmware
qualcomm/sc8280xp-abbb_firmware
qualcomm/sc8380xp_firmware
qualcomm/snapdragon_7c\+_gen_3_compute_firmware
qualcomm/wcd9380_firmware
qualcomm/wcd9385_firmware
qualcomm/wsa8830_firmware
qualcomm/wsa8835_firmware
... and 3 more
Published Jun 03, 2024
Tracked Since Feb 18, 2026